Wafer Breaking_Galatek

OFFICIALMAIL@GALATEK.AI

Home

Products & Solutions

Life Sciences.

Automated Cell Culture Integrated System

Automated Chemical Synthesis Integrated System

Automated High Throughput Drug Screening Integrated System

Automated Mobile Phase Preparation Integrated System

Automated Synthetic Biology Integrated System

Chemical Chromatography Intelligent Analysis and Testing System

Galatek Smart Plate Handler

High Content Cell Imaging System

Intelligent Collaborative AGV Robot

Liquid Handling Workstation Series

Reagent/Consumable

Semiconductor.

Overlay Metrology

Wafer Advanced Inspection

Laser Dicing

Laser Grooving

Blade Dicing

Wafer Breaking

Sustainable Energy.

About

Join Us

Contact Us

News

Download Center
Products & Solutions
About
Join Us
Contact Us

OFFICIALMAIL@GALATEK.AI

21 Media Circle #06-04, Singapore 138562

Wafer Breaking
Wafer Breaking
Galatek wafer breaking system integrates advanced breaking processes with high-precision motion control technology. It supports fully automated loading and unloading, automatic image correction, automatic breaking and path adjustment, as well as production data reporting. It is designed for high-efficiency, high-precision processing of silicon carbide (SiC) wafers and MiniLED wafers used in commercial and automotive displays. The system can also be extended to breaking applications for glass, optical filters, and other brittle materials.

Product Introduction

InspiraUltra/InspiraUltra SAP

InspiraUltra/InspiraUltra SAP
InspiraUltra/InspiraUltra SAP

Galatek InspiraUltra Wafer Breaking System integrate advanced breaking processes with high-precision motion control technologies. The systems support fully automated loading and unloading, automatic image correction, automatic breaking with real-time adjustment, and production data reporting. Supported materials: silicon carbide (SiC), ceramics, and lithium tantalate. Galatek InspiraUltra SAP Wafer Breaking System is developed based on an advanced vision technology platform with AI algorithm, specifically designed for breaking MiniLED display wafers. It enables high-precision processing of 10 µm scribe lanes. The system features one-button startup, fully automated loading and unloading, automatic image correction, automatic breaking with adjustment, and multiple functions that meet requirements for wafer-processing production lines.

Solution Feature

High adaptability
High adaptability
Supports 4/6/8-inch wafers and is equipped with SECS/GEM interfaces
One-Touch Automated Operation
One-Touch Automated Operation
Integrates automatic cassette loading/unloading, automatic barcode scanning, automatic wafer and partial-wafer compatibility, and automatic leveling correction
Process compatibility
Process compatibility
Supports automatic front-side and back-side breaking processes, meeting the breaking requirements of various brittle materials
Consistency of processing
Consistency of processing
Features automatic breaking-position correction and blade-depth compensation to ensure consistent processing results
Versatile breaking modes
Versatile breaking modes
Supports multiple combined breaking strategies, including forward breaking, reverse breaking, skip breaking, and quadrant breaking
High precision vision system
High precision vision system
Equipped with automatic image recognition, capable of identifying various product characteristics with high accuracy, effectively preventing misidentification between different product types

Application Scenarios

Semiconductor Wafers (Si , SiC)
Semiconductor Wafers (Si , SiC)
LED Wafers (Sapphire)
LED Wafers (Sapphire)
Ceramic Materials
Ceramic Materials

Contact us

Have read and accepted the Privacy Policy and Terms of Service
Download document
Have read and accepted the Privacy Policy and Terms of Service