Laser Grooving_Galatek

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Laser Grooving
Laser Grooving
As one of the core precision processing equipment, laser grooving machines have played an increasingly critical role in key manufacturing processes across wafer materials, packaging, and testing industries in recent years. Their primary technical applications include traditional surface groove machining and grooving processes for Low-K materials. By integrating high precision motion control with advanced laser optical systems, the equipment enables micron-level groove processing with high efficiency and minimal thermal impact.

Product Introduction

InspiraX

InspiraX
InspiraX

Galatek InspiraX laser grooving system is a high precision and high efficiency precision machining platform developed based on the characteristics of Low-K dielectric materials and the principles of laser grooving processes. The equipment is designed for one-touch operation, with automatic barcode reading and recipe loading, as well as automated cleaning, coating, and cutting. It also integrates production data reporting, utilization statistics, and data uploading functions to meet production line requirements.

Solution Feature

High Compatibility
High Compatibility
Supports 8-inch and 12-inch wafers with Low-K dielectric layers
High Precision Motion Control
High Precision Motion Control
Achieves motion speeds of up to 1000 mm/s with <1% fluctuation during high-speed travel
One-Touch Automated Operation
One-Touch Automated Operation
Integrates automated loading/unloading, coating, leveling, auto-correction, auto cleaning, and production data reporting
Advanced Vision Platform
Advanced Vision Platform
Built on a new generation AI vision platform, providing precise image processing and accurate positioning
Industry Process Breakthrough
Industry Process Breakthrough
Non-contact cutting with minimal thermal impact; adopts dual-narrow-beam and dual-wide-beam laser cutting technology, supporting a groove width range of 20 to 80 μm
User-Friendly Interface
User-Friendly Interface
Intuitive interface design for easy operation and quick training

Application Scenarios

Silicon Wafers with Low - K Film Layers
Silicon Wafers with Low - K Film Layers
Silicon Wafers
Silicon Wafers
Processing Scenarios with Multiple Grooving Function Combinations
Processing Scenarios with Multiple Grooving Function Combinations

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