Laser Dicing_Galatek

Galatek InspiraSlice laser dicing system are precision laser processing tools based on internal-focus technology, designed for cutting silicon (Si) wafers. Developed on a vision-technology platform, the system integrates automatic contour recognition, automatic leveling correction, automatic reference-point setup, auto-focus, and other intelligent functions. The entire system is engineered for one-touch operation, supporting automated barcode reading and recipe loading. As a fully automated processing tool, it also incorporates production data logging, equipment utilization statistics, and data upload capabilities to meet semiconductor manufacturing standards.

Galatek InspiraSlice SAP laser dicing system is a high-precision, high-efficiency laser processing tool developed specifically based on the material characteristics of sapphire. By utilizing internal-focus laser cutting technology, the system enables high-quality machining of sapphire wafers. Developed on an advanced vision-technology platform, the system integrates functions such as automatic contour recognition, automatic leveling, automatic reference-point setting, and auto-focus. Designed for one-touch operation, it supports automatic barcode reading and recipe loading. As a fully automated production system, it also incorporates production data logging, equipment utilization statistics, and data uploading functions to meet semiconductor manufacturing standards.