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Product Introduction
Galatek InspiraBlade DUO wafer dicing machines include fully automatic dual-spindle and semi-automatic single-spindle models. They are widely applicable for cutting materials such as silicon wafers, GaAs, GaN, sapphire, ceramics, lithium tantalate, and PCBs. The equipment features high-resolution image positioning, automatic kerf detection, BBD blade break detection, and NCS non-contact height measurement capabilities.
Galatek InspiraBlade series wafer dicing saws include fully automated dual-spindle and semi-automatic single-spindle models, suitable for processing various materials including silicon wafers, GaAs, GaN, sapphire, ceramics, lithium niobate, and PCBs. Equipped with high-definition image alignment, automatic blade mark detection, BBD (Blade Breakage Detection), NCS (Non-Contact Sensor) for height measurement, and other advanced functions.
Galatek InspiraBlade series wafer dicing saws include fully automated dual-spindle and semi-automatic single-spindle models, suitable for processing various materials including silicon wafers, GaAs, GaN, sapphire, ceramics, lithium niobate, and PCBs. Equipped with high-definition image alignment, automatic blade mark detection, BBD (Blade Breakage Detection), NCS (Non-Contact Sensor) for height measurement, and other advanced functions.
Galatek InspiraBlade series wafer dicing saws include fully automated dual-spindle and semi-automatic single-spindle models, suitable for processing various materials including silicon wafers, GaAs, GaN, sapphire, ceramics, lithium niobate, and PCBs. Equipped with high-definition image alignment, automatic blade mark detection, BBD (Blade Breakage Detection), NCS (Non-Contact Sensor) for height measurement, and other advanced functions.
Galatek InspiraBlade series wafer dicing saws include fully automated dual-spindle and semi-automatic single-spindle models, suitable for processing various materials including silicon wafers, GaAs, GaN, sapphire, ceramics, lithium niobate, and PCBs. Equipped with high-definition image alignment, automatic blade mark detection, BBD (Blade Breakage Detection), NCS (Non-Contact Sensor) for height measurement, and other advanced functions.
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