Wafer Advanced Inspection_Galatek

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Wafer Advanced Inspection
Wafer Advanced Inspection
Fully automated wafer inspection is a critical process in semiconductor manufacturing. It is primarily used to detect microscopic defects on wafer surfaces such as scratches, contamination, particles, and other anomalies. As process technology continues to advance and device geometries shrink, the requirements for wafer quality have become increasingly stringent. Fully automated inspection systems have therefore become essential to ensuring both production efficiency and product reliability.

Product Introduction

InspiraInspect WF

InspiraInspect 3D

InspiraInspect

InspiraInspect WF+

InspiraInspect WF
InspiraInspect WF

Galatek InspiraInspect WF is designed for appearance defect inspection on patterned wafers. It supports both macro and micro defect detection, capable of identifying systematic defects as well as random defects on the wafer surface. As a high-performance inspection solution, it plays a key role in wafer fabs for product quality control and yield management.

InspiraInspect 3D
InspiraInspect 3D

Galatek InspiraInspect 3D is built upon the 2D wafer AOI platform, InspiraInspect WF, and further integrates 3D structural metrology capabilities. In addition to performing high-precision macro and micro defect inspection on wafer surfaces, it also enables three-dimensional measurement of critical structures. It serves as one of the core inspection systems for wafer fabs and OSAT facilities in yield management, process monitoring, and structural verification.

InspiraInspect
InspiraInspect

Fully automated post-dicing wafer inspection system built upon InspiraInspect WF. Enhanced with automated loading/unloading capability for post-dicing wafers with ring frames, Specialized defect-inspection algorithms optimized for post-dicing wafer characteristics, Inspection capability for wafer expansion-film defects.

InspiraInspect WF+
InspiraInspect WF+

Galatek InspiraInspect WF+ is designed for advanced process inspection. Building upon the standard wafer inspection system, InspiraInspect WF, it offers enhanced overall hardware precision, high-resolution imaging capability, high-accuracy real-time autofocus, and advanced process pattern defect detection. It is one of the core systems for process inspection and wafer yield management in MEMS, power semiconductor, and other advanced semiconductor manufacturing processes.

Solution Feature

High Compatibility
High Compatibility
Compatible with 8-inch and 12-inch patterned wafer inspection
Through customization, it can also support 4 - 6 inch wafers, as well as post-dicing wafers and reconstructed wafers
Wide Inspection Coverage
Wide Inspection Coverage
Inspection targets: RDL, Bump, Pad, PMI, UBM, Via, Overlay, etc
Inspection capabilities: defect location, length/width measurement, area measurement, feature diameter/hole size, displacement, missing features, and more
AI-Enhanced Performance
AI-Enhanced Performance
Equipped with a proprietary AI vision fusion algorithm that significantly enhances defect detection capability while reducing false positives and miss rates
Supports AI-based Automated Defect Classification (AI-ADC) with high classification accuracy
Software & Connectivity
Software & Connectivity
Supports SECS/GEM interface for remote equipment monitoring and operation
Compatible with Sinf, Klarf, and other map file formats for input and output
High Accuracy
High Accuracy
Detectable defect size: down to 1 μm
High Throughput
High Throughput
Throughput ≥ 35 WPH (12-inch wafer, 5× objective, excluding review time)

Solution Feature

High Compatibility
High Compatibility
Supports patterned wafer inspection for 8-inch and 12-inch wafers, with full compatibility for 2D defect inspection, critical dimension (CD) measurement, 3D height/co-planarity measurement, and 3D defect detection
Wide Inspection Coverage
Wide Inspection Coverage
Applicable wafer types: Silicon, compound semiconductors, ceramic wafers, TSV wafers, etc
Inspection targets: Copper pillars, solder bumps, gold bumps, micro-bumps, TSV structures, and more
Measurement capabilities: Height, depth, and co-planarity
Measurement range: Bump Height 1–3000 μm, Bump Depth 10–3000 μm
AI-Enhanced Performance
AI-Enhanced Performance
Equipped with a proprietary AI vision fusion algorithm that significantly enhances defect detection capability while reducing false positives and miss rates
Supports AI-based Automated Defect Classification (AI-ADC) with high classification accuracy
Software & Connectivity
Software & Connectivity
Supports SECS/GEM interface for remote equipment monitoring and operation
Compatible with Sinf, Klarf, and other map file formats for input and output
High Accuracy
High Accuracy
Detectable defect size: as small as 1 μm
3D height measurement repeatability: ≤ 0.2 μm (using high-precision 3D imaging module)
High Throughput
High Throughput
Throughput: ≥ 30 WPH (for 12-inch wafers, using high-throughput 3D imaging module only)

Solution Feature

High Compatibility
High Compatibility
Compatible with post-dicing inspection for patterned wafers from 4 to 12 inches
Supports 2D defect inspection and critical dimension (CD) measurement capabilities
Wide Inspection Coverage
Wide Inspection Coverage
Inspection targets include chip misalignment, chipping, corner break, cracks, scratches, particles, missing dies, and more
Measurement items include length/width, area, position offset, etc
 Software & Connectivity
Software & Connectivity
Supports SECS/GEM interface for remote equipment monitoring and operation. Supports Sinf, Klarf, and other map file formats for input/output
Supports ink dot marking feature
High Accuracy
High Accuracy
Defect inspection accuracy: ≤ 2 μm

Solution Feature

High Compatibility
High Compatibility
Compatible with 4 to 8 inch patterned wafers for process defect inspection, featuring high-precision 2D defect detection and dimensional measurement capabilities
Wide Inspection Coverage
Wide Inspection Coverage
plicable to patterned wafer products such as MEMS, SiC, GaN, and supports transparent, semi-transparent, and opaque wafer substrates
Inspection capabilities include defect localization, length/width, area, and key features such as critical dimension (CD) measurements, diameter, aperture, spacing, pattern shift, pattern missing, etc
AI-Enhanced Performance
AI-Enhanced Performance
Equipped with a proprietary AI vision fusion algorithm that significantly enhances defect detection capability while reducing false positives and miss rates
Supports AI-based Automated Defect Classification (AI-ADC) with high classification accuracy
Software & Connectivity
Software & Connectivity
Supports SECS/GEM interface for remote equipment monitoring and operation, and provides input/output for Sinf, Klarf, and other map formats
High Accuracy
High Accuracy
Detectable defect size as small as ≤ 0.5 μm
High Throughput
High Throughput
A deeply optimized workflow with high-parallel image scanning and real-time defect detection ensures consistently high equipment throughput

Application Scenarios

Outgoing Inspection in Wafer Fabs and Incoming Inspection in Assembly & Test Plants
Outgoing Inspection in Wafer Fabs and Incoming Inspection in Assembly & Test Plants
Post-CP Defect Detection in Packaging
Post-CP Defect Detection in Packaging
Wafer Fab Process Inspection
Wafer Fab Process Inspection
Advanced Packaging Process Inspection
Advanced Packaging Process Inspection
Wafer Visual Defect Detection in Various Process Stages
Wafer Visual Defect Detection in Various Process Stages
Post-Wafer Dicing Defect Detection
Post-Wafer Dicing Defect Detection
Reconstituted Wafer Inspection
Reconstituted Wafer Inspection
MicroLED Wafer Process Inspection & Mass Transfer Inspection
MicroLED Wafer Process Inspection & Mass Transfer Inspection

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