Overlay Metrology_Galatek

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Overlay Metrology
Overlay Metrology
Overlay error is a critical process that must be tightly controlled in semiconductor manufacturing. As process technologies continue to advance, the required precision for overlay control becomes increasingly stringent. A fully automated overlay metrology system provides nanometer to sub-nanometer overlay measurement accuracy and overlay control solutions, significantly improving manufacturing yield.

Product Introduction

InspiraMetrix DUO

InspiraMetrix

InspiraMetrix PLUS

InspiraMetrix AV

InspiraMetrix DUO
InspiraMetrix DUO

Galatek InspiraMetrix DUO is designed for single-sided, double-sided, and infrared (IR) overlay measurements in lithography processes. Equipped with both visible-light and infrared microscopic imaging systems, it delivers high-speed, high-precision, and multifunctional metrology capabilities. It is a key tool for yield management in MEMS fabs and lithography (photo) areas of semiconductor manufacturing.

InspiraMetrix
InspiraMetrix

Galatek InspiraMetrix system is designed for automatic single-sided overlay measurement in 8-inch and 12-inch wafer fabs. It is equipped with a high-performance imaging system and a real-time autofocus system, delivering high-precision and high-speed overlay measurement capability. It serves as a key tool for yield management in semiconductor manufacturing processes.

InspiraMetrix PLUS
InspiraMetrix PLUS

Galatek InspiraMetrix PLUS is designed for single-sided overlay metrology in 8-inch and 12-inch wafer fabs. It is equipped with a high-performance imaging system and a real-time autofocus system, delivering high-precision and high-speed overlay measurement capabilities. It serves as a critical tool for yield management throughout the semiconductor manufacturing process.

InspiraMetrix AV
InspiraMetrix AV

Galatek InspiraMetrix AV is designed for single-sided overlay measurement on 12-inch wafers. Equipped with a high-performance imaging system and real-time autofocus technology, it delivers high-precision, high-speed overlay metrology performance. It is a key tool for yield management in semiconductor manufacturing processes.

Solution Feature

High Compatibility
High Compatibility
Compatible with 6-inch, 8-inch, and 12-inch wafers, supporting both flat and notch alignment modes
 Versatile Functionality
Versatile Functionality
Equipped with a broadband illumination system, supporting single-sided, double-sided, and internal overlay measurement. Compatible with Frame-in-Frame, Circle-in-Circle, Cross-in-Cross, and any other customized overlay marks
Software & Connectivity
Software & Connectivity
Supports SECS/GEM interface protocol, enabling remote equipment monitoring and operation

Solution Feature

High Compatibility
High Compatibility
Compatible with 8-inch and 12-inch wafers, supporting both Flat and Notch alignment methods
Versatile Functionality
Versatile Functionality
Equipped with a broadband illumination system, supporting single-sided overlay measurement. Compatible with BIB and AIM-type overlay marks
Software & Connectivity
Software & Connectivity
Supports SECS/GEM interface protocol for remote equipment monitoring and operation

Solution Feature

High Compatibility
High Compatibility
Compatible with 8-inch and 12-inch wafers, supporting both Flat and Notch alignment methods
Measurement Performance
Measurement Performance
Measurement repeatability and TIS error are improved by 2× compared to the previous generation, meeting the metrology requirements of high-end processes
Throughput Upgrade
Throughput Upgrade
Equipped with interferometric autofocus, significantly reducing focusing time and enhancing the dynamic performance of the motion stage, resulting in a 2× improvement in overall MAM (Move–Align–Measure)

Solution Feature

Measurement Performance
Measurement Performance
Measurement performance is improved by another twofold compared with the previous generation, fully meeting the requirements of advanced process nodes
 Process Adaptability
Process Adaptability
Equipped with advanced modes such as continuously tunable wavelength, adjustable polarization, and automatic recipe optimization, enabling strong adaptability to various complex process scenarios

Application Scenarios

Yield Management in MEMS Device Manufacturing
Yield Management in MEMS Device Manufacturing
Precision Assurance for RF Devices
Precision Assurance for RF Devices
Alignment Inspection for HBM 3D Stacking
Alignment Inspection for HBM 3D Stacking
Process Control for High-Density 3D IC Integration
Process Control for High-Density 3D IC Integration
Logic and Memory Device Yield Control
Logic and Memory Device Yield Control

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