Wafer Breaking System_Galatek

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OFFICIALMAIL@GALATEK.AI

Oskar-Schlemmer-Str 23, 80807 Munchen, Germany

Wafer Breaking System
Wafer Breaking System
Wafer Breaking System, integrating advanced breaking process, high precision motion control and other key technologies, automatic loading and unloading, automatic image correction, automatic breaking and correction, production data report statistics and other functions.

Product Introduction

Wafer Breaking System MRS-PT560

Wafer Breaking System MRS-PT560
Wafer Breaking System MRS-PT560

Galatek MRS-PT series Wafer Breaking System, integrating advanced breaking process, high precision motion control and other key technologies, automatic loading and unloading, automatic image correction, automatic breaking and correction, production data report statistics and other functions. Applicable materials: Silicon carbide, ceramics, lithium tantalate

Product Features

High-precision Vision System
High-precision Vision System
With automatic image recognition function, can identify various product features, high recognition accuracy, can effectively avoid different product misidentification.
Multiple Breaking Modes
Multiple Breaking Modes
Multiple breaking modes: breaking in order, breaking in reverse order, skipped breaking, quartered breaking and mixed breaking.
Process Consistency Guarantee
Process Consistency Guarantee
Supports automatic correction for wafer breaking position, tool depth compensation and other functions to ensure the consistency of breaking effect.
Process Compatibility
Process Compatibility
Support front and back breaking process to meet the breaking needs of multiple materials with different brittleness.
One-click Automatic Production
One-click Automatic Production
Integrating casette loading and unloading, automatic code scanning, automatic adaptation to the rounded and incomplete wafer, automatic alignment and other functions.
High Compatibility
High Compatibility
4/6 inch wafer and SECS, GEM standard interface

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